Intel Undergraduate Logistics & Packaging Engineering Intern 2019 in Phoenix, Arizona
If you are looking for a unique and interesting summer internship look no further. Intel’s Transport Materials and Media Engineering Group is looking for a motivated summer intern for 2018.
The “Transport Materials and Media Engineering Group” (TMME) is a worldwide organization that delivers shipping media and packaging solutions for all Intel products and direct materials used in our manufacturing facilities and warehouse operations.
TMME is responsible for the design, development, and qualification for the shipping media’s and packaging used to transport materials internally site to site and all finished products shipped to our customers. This includes wafers, bare die, finished microprocessors, solid state drives, board assemblies, and equipment related products to name a few.
The successful candidate will be designing as well as conducting test experiments to gather baseline performance data on Intel shipping media and packaging to help understand design requirements and materials necessary to protect Intel products now and in the future. This will require working in a lab environment using packaging test equipment and methodologies such as packaged drop, vibration, unpack shock, accelerator data acquisition, and data analysis using Excel and JMP statistical software.
Individual may also be involved in adhoc testing as needed to support any and all media and packaging related requests for qualifications and or package testing to help understand the design and qualification process.
The Ideal Candidate Should Exhibit The Following Behavioral Traits:
Applicants should be hands on and not afraid to work in a Lab environment doing design of experiments on packaging and cushioning systems.
Applicants should be able to demonstrate results in academic programs and projects related to the areas outlined below.
Strong mechanical aptitude.
Strong written and verbal communication skills.
Working with Excel spreadsheets.
Excellent planning, organization, presentation, and teamwork skills.
Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Applicants must be enrolled in an accredited University either in or entering their senior year of studies and working toward a BS degree in Packaging, Mechanical, or Industrial Engineering or related field.
This U.S. position is open to U.S. Workers Only. A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government. Intel will not sponsor a foreign national for this position.
Familiarity and or experience with Packaging Drop and Vibration, and Unpackaged Shock test methodologies.
Key skill sets necessary to be successful include:
Statistical data analysis – excel and JMP statistical software.
Design of Experiments.
Design Software - ArtiosCAD or similar CAD system, Solidworks or similar 3D Software.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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